DeepCool at Computex 2026: Unveiling VC 2.0 vapour chamber air coolers

DeepCool has announced its product showcase for the upcoming Computex 2026 exhibition, scheduled from June 2 to June 5 at the Taipei Nangang Exhibition Centre (Hall 1). The lineup outlines the company's engineering focus for the coming year, introducing advancements across vapour chamber air cooling, smart liquid cooling blocks, wireless fan interconnects, and panoramic display-integrated computer cases.

The product releases arrive amid growing component thermal density, where modern desktop CPUs and high-core workstations demand sophisticated cooling solutions to manage thermal throttling during prolonged computing operations.

Advancing air cooling with VC 2.0 vapour chambers

The centrepiece of DeepCool's updated air-cooling engineering is the ASSASSIN V VISION, the latest iteration of its dual-tower flagship computing platform. The unit shifts away from standard heat pipe copper contact bases to a newly developed VC 2.0 vapour chamber base. This system is paired with a redesigned, more compact heatsink fin stack to optimise component clearance, and an integrated 4.5-inch LCD module on the top shroud to output real-time system metric logs.

DeepCool is scaling this underlying VC 2.0 architecture to target low-profile and mainstream sectors:

• AN600 VC: Evaluated as a low-profile option designed to bring vapour chamber heat dissipation to compact Small Form Factor (SFF) systems.

• AK700 VC & AK700 VC WH: Updates the established dual-fan tower series with the VC 2.0 base array, coupled with modified fan acoustic profiles to limit operational resonance.

• StationX 620 Workstation Cooler: Purpose-built to support massive computing architectures, engineered specifically for high-core-count AMD Threadripper and AMD EPYC processors. Designed to conform to 4U enterprise server rack configurations, the single-tower unit is rated for a massive 540W Thermal Design Power (TDP) threshold.

SILENTNOX PRO: Liquid cooling with flexible curved displays

Marking a new design path for All-in-One (AIO) liquid coolers, DeepCool is hosting the international premiere of its SILENTNOX PRO 360. The unit centres its visual engineering around a 6.67-inch 2K flexible curved display integrated into the pump block enclosure.

Internally, the liquid loop relies on DeepCool's latest proprietary in-house motor pump assembly. The impeller geometry and motor wind are calibrated for low-noise operation, matching enthusiast demand for systems that minimise acoustic profiles without compromising pump head speed or pressure characteristics.

Industrial fan balancing and wireless connectivity

To address the cable management difficulties associated with modern multi-fan system layouts, DeepCool is introducing wireless fan connectivity architecture. The connection mechanism eliminates standard individual PWM and RGB routing blocks, allowing adjacent chassis fans to share data and power via internal point-contact pins to reduce interior cable congestion.

Furthermore, the brand has aligned its fan production with the computing sector's strict manufacturing criteria, adopting Industrial-grade G6.3 dynamic balancing benchmarks (ISO 21940). This mechanical calibration limits microscopic structural wobbles along the blade axis during high-RPM rotation, reducing long-term frame resonance, bearing wear, and acoustic degradation over years of operation.

Chassis designs focused on panoramic visibility and SFF toolless maintenance

The desktop enclosure division has received complementary expansions targeting both display-centric builds and low-footprint configurations:

• CH690 LCD Showcase Chassis: Expands the dual-chamber panoramic format, introducing a factory-integrated 7-inch IPS display panel on the lower layout. The case packages four pre-installed Addressable RGB (ARGB) cooling fans and ambient diffusion strips to illuminate internal high-end components.

• CH170 PLUS UES SFF Chassis: An upgraded iteration of the brand's low-footprint vertical enclosure. The design integrates redesigned toolless, quick-release side panels to improve hardware access during troubleshooting or cleaning routines, maximising interior space allocation for dual-slot graphics cards.

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