Fujifilm will showcase semiconductor materials at SEMICON India 2026

India’s semiconductor ambitions are creating demand well beyond chips and fabrication equipment. Materials, technical expertise and reliable supply chains are becoming part of the same conversation. Against this backdrop, FUJIFILM India is using SEMICON India 2026 to put its semiconductor materials portfolio and localisation efforts in focus.

The company will participate in the September 17–19 exhibition at Yashobhoomi, New Delhi, where it plans to showcase semiconductor materials covering multiple stages of manufacturing, along with its global technology capabilities.

Fujifilm links materials to India’s chip ambitions

The Fujifilm semiconductor materials portfolio spans processes covering both leading-edge and legacy semiconductors. At SEMICON India 2026, the company will highlight Chemical Mechanical Planarization (CMP) slurry solutions through a technology demonstration.

The focus is significant because the demonstration is designed to show how material technologies support precision planarization and process consistency during semiconductor fabrication. Fujifilm will also showcase its Make in India initiatives as it looks to connect its global capabilities with requirements emerging from the Indian market.

Localisation becomes part of the strategy

Fujifilm’s presence at the exhibition also follows its wider engagement with India’s semiconductor ecosystem. In June 2026, FUJIFILM India signed an MoU with the Gujarat State Electronics Mission to explore opportunities for semiconductor materials manufacturing in Gujarat and strengthen domestic supply-chain capabilities.

This gives the company’s exhibition presence a broader angle. Rather than focusing only on showcasing products, Fujifilm is positioning its India engagement around understanding local requirements and exploring collaboration with customers, government stakeholders and industry partners.

CMP technology highlights the materials challenge

One of the key demonstrations will be a working model of Fujifilm’s CMP slurries, with the company stating that the technology can achieve polished circuit surface flatness within 0.4 nanometers.

For the broader India semiconductor ecosystem, the emphasis highlights how manufacturing requirements extend into highly precise material technologies. Fujifilm plans to use SEMICON India 2026 to engage semiconductor manufacturers, suppliers and policymakers while exploring further localisation opportunities.

SEMICON India becomes a meeting point

Scheduled for September 17–19 at Yashobhoomi, Hall 1, Booth 623, SEMICON India 2026 will give Fujifilm a platform to connect its global semiconductor materials expertise with India’s evolving manufacturing ambitions.

The larger takeaway is that India’s semiconductor buildout is opening space for companies operating across the value chain, not just chipmakers. For Fujifilm, the next phase appears focused on bringing materials expertise closer to the Indian market while exploring how local manufacturing and supply chains can develop alongside the ecosystem.

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